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Dr. Jerry Ser gent is the Chairman
of the Electrical Engineering Department at Fairfield University
and is considered to be one of the world’s leading experts
in Electronic Packaging. He has authored two books and over seventy
technical papers and has three patents to his credit. He is a past
President of the International Microelectronics and Packaging Society
and has received every major award in the Microelectronics Industry. |
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DR. SERGENT SPOKE OF THE
IMPORTANCE OF BONDING TO ELECTRONIC COMPONENTS |
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The
two most prevalent trends in electronics today are “faster”
and “smaller”. These two trends, when coupled together,
represent a significant challenge for the Electronics Packaging Engineer.
As electronic circuits operate faster, they generate more heat as
a result of switching losses. As they become smaller, the power density
increases, making the circuit heat up even more than it would in a
conventional packaging scheme. Higher temperatures lower the reliability
of components and also place additional mechanical stresses at the
interface between the component and the board. This presentation considers
the problems encountered by the Packaging Engineer when dealing with
a power electronics circuit and some potential solutions. |
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RULE OF THUMB |
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Presented
was a rule of thumb relating to the importance of temperature on Mean
Time Between Failure of Electronic devices. |
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Dr.
Sergeant plans to continue his work with the improvements in microelectronic
circuits. He emphasized the automobile industry is a major challenge
with the most stringent requirements. |
SUMMARY
Excessive heat is a serious
reliability issue for electronic circuits
Cooling of Microelectronics is challenging
Strategy: Remove heat from junction and
transport it to a site where it can be readily dissipated. |
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last update SEPTEMBER 16, 2008 |
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